IC-3C is based on advanced iMEMS (Integrated Micro Electro Mechanical System) platform design for a new generation non-cooling thermal imaging sensor with low cost, compact size, low power consumption and high Cost performance.
IC-3C uses a unique FPA image-enhancing pixel array and ROIC readout circuit. It implements registers and NUC configurations through the SDIO interface, and uses CLCC ceramic package to solve the heat dissipation and greatly reduce the overall power consumption.
IC-3C can improve the comprehensive performance of your devices, and can meet the needs of low cost, compact size, high reliability and cost-effective applications. It can be applied to smart home, security, vehicle & handheld devices.
Basic Specification：
|
Item |
Unit |
Specification |
|
Sensor Type |
|
Non-cooling infrared array sensor |
|
Resolution |
|
320×240 |
|
Pixel Size |
μm |
12 |
|
Wavelength Range |
μm |
8～14 |
|
Sensitivity |
mk |
≤70mK，（@f1.0,300k，30Hz） |
|
Typical Response Rate |
mV/K |
12 |
|
Effective Frame Rate |
Frame/s |
Max.60 |
Electrical:
|
Item |
Unit |
Specification |
|
Input |
V |
1.8/5 (Internal bias reference) |
|
Power consumption |
mW |
＜120 |
|
Signal Output Dynamic Range |
V |
0～5 |
|
Control |
|
SDIO Interface |
Others：
|
Item |
Unit |
Specification |
|
Package type |
|
CLCC Ceramic, High Vacuum Package, Built-in High Performance Getter |
|
Dimensions (W*H*D) |
mm |
|
|
Digital-analog mixing process |
nm |
90～180 |
|
Working Temperature |
℃ |
|
|
Storage Temperature |
℃ |
|
